Inspection and measuring equipment|Optical inspection equipment|Substrate Bump Inspection System

RSH-120

companies handling the product:Nidec Advance Technology Corporation

IC Substrate 2D/3D Bump Test System

Capable of implementing next generation IC Substrate 3D Bump inspection. Apply for Height & Vision inspection simultaneously (uBump, Round/Flattened, Warpage)

characteristics:
Higher Throughput, Highest accuracy. Optimized Interface, Increased Usability. Implement Highest Throughput Dual Head Machine also available.
Contact information for product inquiry
Contact Us

Contact information for product inquiry

Nidec Advance Technology Corporation

inquiry by e-mail

inquiry by phone

+81-75-280-8100

business hours: 9:00 - 17:30 (Mon. - Fri. Weekdays only)

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