Inspection and measuring equipment｜Optical inspection equipment｜Wafer Bump Inspection System
RWi-300
companies handling the product：Nidec Advance Technology Corporation
Gold Bump Wafer Process 2D/3D Inspection System
Fully Integrated Simultaneous 2D/3D & High-Speed Scanning for Gold Bump Wafer
- characteristics:
- Simultaneous 3D and 2D Defect Inspection (including pitting, nodules, midget, etc.). Top Gold Bump Manufacturers Selected RWi-300G in 2017. Capable of All the Gold Bump Metrology Inspection Requirements.
- Contact information for product inquiry
- Contact Us
Contact information for product inquiry
Nidec Advance Technology Corporation
inquiry by e-mail
inquiry by phone
+81-75-280-8100
business hours: 9:00 - 17:30 (Mon. - Fri. Weekdays only)
