- Company
- NIDEC ADVANCE TECHNOLOGY CORPORATION
- Representative
- President & CEO, Hidekazu Yamazaki
- Address
- Nidec PARK Bldg.C,1-1 Higashinokuchi,Morimoto-cho,
Muko-shi,Kyoto,617-0003,Japan
- Inquiry
- Chief of Corporate Management division, Kiyomu Yamaguchi
- TEL
- ＋81-75-280-8100
Nidec Advance Technology Corporation (“Nidec Advance Technology” or the “Company”) announced today that it will exhibit products at SEMICON Japan 2024, an event to be held at Tokyo International Exhibition Center (“Tokyo Big Sight”) from Wednesday, December 11 – Friday, December 13, 2024.
At this exhibition, the Company will exhibit power semiconductor inspection equipment for IGBT/SiC; drive motor test benches for EVs, HEVs, and other vehicles; probe cards (jigs for wafer inspections); and other cutting-edge solutions. They will be joined by the GATS Series, which is an electrical inspection system for semiconductor package substrates, and optical inspection equipment for 2D and 3D measurements of tiny bumps. Both of these products embody Nidec Advance Technology’s core technological asset of measuring. By utilizing its long-nurtured inspection technologies, the Company will propose its state-of-the-art inspection solutions and new products and technologies that contribute to the future.
■Products on Exhibition
- NATS-1000/1700 Series (insulation, static and dynamic characteristics inspection equipment for IGBT and SiC modules)
- TDAS Series (test bench for EV drive motors)
- RWi Series (an automatic wafer bump inspection system)
- GATS Series (an electrical inspection system for semiconductor package substrates)
- R-700 Series (an AC/DC multi-tester)
- Probe cards for semiconductor wafer inspections
- Pin probes for ultra-high-precision inspections
- NATS-1300 Series (KGD testing equipment)
- NATS-8000 Series (dynamic reliability testing equipment for power semiconductor modules)
- Reference inverters
- NSW Series (3D optical inspection equipment)
