Laser・Semiconductore manufacturing equipment・Metal additive manufacturing｜Laser processing system｜Laser micro machining machines
Trial services for micro-machining and for room temperature wafer bonding
The handling companies : Nidec Machine Tool Corporation
- Contact information for product inquiry
- Contact Us
We offer charged trial services for micro-machining and room temperature wafer bonding.
If your have some of following requests, please contact us.
- 1.To know if these process are applicable for your products
- 2.To use these machines as your research purpose
- 3.To compare other processes with these processes
- 4.To make a prototype using actual machines
- 5.To source some quantity of parts every month instead of installing machines
The machines for this service
Samples of the services
Room Temperature Wafer Bonding Machine BOND MEISTER
Bonded wafers sample consisted of Sic and SI
Laser Micro Machining System ABLASER
Helical milling of heat resistant glasses
Glass thickness ： 0.8㎜
Helical milling of stainless
Stainless thickness ： 0.5㎜
Groove width ：0.05ｍｍ
