Laser・Semiconductore manufacturing equipment・Metal additive manufacturing｜Laser processing system｜Laser micro machining machines
Laser micro machining system ABLASER
The handling companies : Nidec Machine Tool Corporation
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The original laser head technologies are for high precision and high efficiency.
Features
The optical laser head on the original technologies enables high precision helical machining.
The laser head adopts a prism rotator that adjusts and rotates the laser beam to an arbitrary hole diameter, enabling shape processing with sharp edges. It is also possible to drill holes of any cross-sectional shape, such as straight, tapered, reverse tapered or hand-drum-shaped.
Schematic diagram of helical processing
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Normal non-helical processing -
Our helical milling processing
Cutting test results for silicon material
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Straight hole -
Reverse taper hole -
Hand-drum hole
Processing example
Silicon surface straight microhole drilling
| Material | Silicon wafer |
|---|---|
| Hole diameter | 0.15 mm |
| Plate thickness | 0.5 mm |
| Processing time | 9.0 sec/hole |
SiC surface straight microhole drilling
| Material | SiC |
|---|---|
| Hole diameter | 0.08 mm |
| Plate thickness | 1.0 mm |
| Processing time | 15.0 sec/hole |
Machinable ceramic surface straight microhole drilling
| Material | Machinable ceramic |
|---|---|
| Hole diameter | 0.06 mm |
| Plate thickness | 0.6 mm |
| Processing time | 5.0 sec/hole |
Helical milling hole drilling
| Material | Platinum |
|---|---|
| Hole diameter | ⌀2.0 mm |
| Plate thickness | 1.5 mm |
| Processing time | 4.0 sec/hole |
Lithium tantalate (LiTaO3)
| Hole diameter | 0.02 mm |
|---|---|
| Pitch | 0.07 mm |
| Plate thickness | 0.25 mm |
| Aspect ratio | 12.5 |
It is possible to drill ⌀0.02 mm holes in lithium tantalate,
which is used in semiconductor products.
Lithium tantalate & silicon wafer
| Hole diameter | 0.015 mm |
|---|---|
| Pitch | 0.1 mm |
| Plate thickness | 0.2 mm |
| Aspect ratio | 13.3 |
Even for multi-layered materials such as lithium tantalate and silicon, which are used in semiconductor products, holes of ⌀0.015 mm can be drilled using simultaneous processing.
Stainless steel Small diameter hole drilling
| Hole diameter | 0.027 mm |
|---|---|
| Plate thickness | 0.30 mm |
| Aspect ratio | 11.1 |
With the green laser ABLASER, it is possible to drill holes with a minimum diameter of ⌀27 μm.
Cemented carbide Square hole drilling
| Size | 0.20 mm |
|---|---|
| Plate thickness | 1.00 mm |
Even with 1.0 mm thick cemented carbide, square holes with clean edges can be drilled.
Quartz glass Hole drilling
| Hole diameter | φ0.185 mm |
|---|---|
| Pitch | 0.300 mm |
| Plate thickness | 0.2 mm |
| Aspect ratio | 1.08 |
It is possible to process quartz glass with good roundness without thermal effects.
Specifications
| Item | Specifications | Remarks |
|---|---|---|
| X-axis (mm) | 300 | Precision scale equipped as standard |
| Y-axis (mm) | 200 | Precision scale equipped as standard |
| Z-axis (mm) | 100 | Precision scale equipped as standard |
| Positioning accuracy (mm) | ±0.002 | |
| Maximum feed rate (m/min) | 10 | |
| NC device | FANUC 31iB | |
| Maximum output | 30W | |
| Wavelength (nm) | 515 | |
| Laser head | Own products | |
| Workpiece diameter (mm) | ⌀0.05 to 0.3 | It may vary depending on the material. |
| Taper hole control | Forward taper/reverse taper/hand-drum shaped | |
| Assist gas | Selectable for each workpiece | |
| Width × depth × height | 2,040 × 2,590 × 2,220 | Machine body only. Excludes control enclosure and attachments. |
| Weight | 5.0 t | Machine body only. Excludes control enclosure and attachments. |
| Fume collector | Attachments | |
| Internal air conditioning | ||
| X/Y/Z axis bellows | Heat resistant specifications | |
| Option | Centering function Supports sorters Supports clean rooms Other requests are available. |