Business Field
Processing / Inspection Equipment
Processing / Inspection Equipment related to the Nidec Group
Printed Circuit Board / Continuity Inspection System
This equipment offer to conduct open/leak inspections on motherboards, as well as many other printed circuit boards. They can be flexibly configured according to applications in terms of size, type and the number of test pins required.
Optical Vision Inspection System / Semiconductor−Oriented Products
This equipment serves to conduct open/leak inspection of printedpatterns within photomasks and inner/outer layers. These systems are also used to measure the shape of via holes and solder bumps and to find scratches and stains on wafers and substrates.
Semiconductor Package / Continuity Inspection System
This equipment is carrying out open/leak inspection on semiconductor package（MCM/CSP/BGA） and is available for a wide spectrum of middle to large-sized circuit substrates.
Press Machines
Utilizing the technology, production sites, and sales networks of MINSTER, KYORI, ARISA, and VAMCO, we handle from small-sized to large-sized automatic press machines and peripheral equipment.
Measurement / Assembly Equipment
We are involved in a technical revolution for measuring equipment by developing high value-added products that spur on the development of Automatical Measuring Machine and image processing technologies, We respond to the varied needs of our customers with advanced processing technologies.
Precision Measuring Instruments
Nidec provides three categories of measurements, which contribute to the customer's quality improvements. 1） Speed meter which counts the revolution of the rotation, 2） Torque meter and 3） Push/pull gauge which numerically controls at high precision.
Machine Tools
We have a lineup of high-precision machine tools that can meet the needs to machine everything, regardless of its size. Further, with our gear machines, tools, and gear grinders, we help our customers perform high-value-added work.
Laser Products / Room Temperature Wafer Bonder
Based on our company's unique technology, we provide metal additive manufacturing machines using the powder DED method, laser micromachining system, and wafer bonders that enable semiconductor wafer bonding at room temperature.
