检测・计量设备｜光学检测设备｜晶片Bump检测装置
RWi-300
经营本产品的公司名：Nidec Advance Technology Corporation
Gold Bump Wafer Process 2D/3D Inspection System
Fully Integrated Simultaneous 2D/3D & High-Speed Scanning for Gold Bump Wafer
- 特点：
- Simultaneous 3D and 2D Defect Inspection (including pitting, nodules, midget, etc.). Top Gold Bump Manufacturers Selected RWi-300G in 2017. Capable of All the Gold Bump Metrology Inspection Requirements.
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- 相关垂询
关于产品的咨询
尼得科精密検測科技株式会社
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电话垂询
+81-75-280-8100
服务时间：9:00～17:30（周六日节假日除外）
